抄録
This paper discusses the effect of thermal conduction through the air on the sensitivity of thermal infrared detectors fabricated in a bulk micro-machining process from the device's front side. ANSYS analysis shows that the thermal conduction from the edge of the freestanding detector structure to the heat sink (Si substrate) considerably impacts the sensitivity. To confirm this phenomenon experimentally, we fabricated a TEG that includes thermopile infrared sensors with various distances between the edge of the freestanding detector structure and the Si substrate. TEG evaluation shows that the ANSYS analysis is quantitatively in good agreement with the experiment. The results obtained in this study suggest an optimum design from the viewpoint of thermal conduction through the air and the fill factor of the sensitive area.
