シリコンウエハ全面にわたる結晶異方性ウェットエッチング加工での表面加工形状の均一性の向上

抄録

Anisotropic wet etching is a useful processing method for the fabrication of three-dimensional microstructures on single crystal silicon (SCS) substrates. We can control the shapes of the etched microstructures and their surface condition by the combination of the etch mask patterns and the etching process conditions. In this paper, we attempted to fabricate the array of convex micro-pyramids or frustums of the pyramid on 4-inch SCS wafers using anisotropic wet etching of the silicon in the solutions containing tetra methyl ammonium hydroxide and isopropyl alcohol. We have successfully increased the shape homogeneity of the microstructures fabricated on whole surface of one side of the wafers by improving the experimental set-up for the etching process and the stability of the liquid temperature of the etching solution.