High Sensitive TSP for Optical Readout Infrared Thermal Imaging Devices

抄録

This paper reports the sensitivity of various Eu(TTA)₃-based temperature sensitive paints (TSPs) which can be used in an infrared thermal imaging device. Two types of polymer binders (PSAMS and PVB) mixing with various concentration of Eu(TTA)₃ were prepared and examined. The TSP using PSAMS had a higher temperature sensitivity compared with that using PVB when the temperature was less than 38^oC. The maximum sensitivity as high as 9.0%/ ^oC was obtained by mixing 360 mg of Eu(TTA)₃ with 1 g of PSAMS. The theoretical model of a thermal imaging device reveals that the temperature sensitivity of TSP has a great impact on the performance of the thermal imaging device. A NETD as small as 0.16 K can be obtained by using the high sensitive TSP developed here.