特集解説
厚膜フォトレジストを構造体としたバイオマイクロデバイス
2017 年 137 巻 10 号 p. 314-317
詳細
2017 年 137 巻 10 号 p. 314-317
Recently, complex microstructures are required for microsystems with expanse of application fields. There is a limit in two-dimensional layer stacking method based on the conventional semiconductor manufacturing process because the processing process has been complicated with the processing microstructures. In this paper, a simple fabrication process using a three-dimensional UV lithography in combination with rotation and inclination of single mask is introduced. In addition, applications for bio-microsystems are shown in order to confirm the validity of the proposed fabrication process.
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