IEEJ Transactions on Sensors and Micromachines
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
Forming Holes in Silicon Substrates by using Ultrasonic Machining
Shinsuke Hannoe
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1997 Volume 117 Issue 1 Pages 55-56

[Correction] IEEJ Trans.SM Vol.117 No.2 (1997) pp.122-122
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IEEJ Transactions on Industry Applications

IEEJ Transactions on Electronics, Information and Systems

IEEJ Transactions on Power and Energy

IEEJ Transactions on Fundamentals and Materials

The Journal of The Institute of Electrical Engineers of Japan

The transactions of the Institute of Electrical Engineers of Japan.C

The transactions of the Institute of Electrical Engineers of Japan.B

The transactions of the Institute of Electrical Engineers of Japan.A

The Journal of the Institute of Electrical Engineers of Japan

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The Journal of The Institute of Electrical Engineers of Japan
IEEJ Transactions on Fundamentals and Materials
IEEJ Transactions on Power and Energy
IEEJ Transactions on Electronics, Information and Systems
IEEJ Transactions on Industry Applications
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IEEJ Transactions on Electrical and Electronic Engineering
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