Monolithic Fabrication of Flexible Film and Thinned Integrated Circuits

Abstract

A new monolithic device technology for micromachines has been developed. This device consists of a flexible film and thinned integrated circuits. The fabrication process is compatible with high performance CMOS devices. The flexible film includes high density wires and other electric functions in several micrometers thick. The integrated circuits are thinned by electrochemical etching to less than 20μm thick. This device is useful for integration and size reduction of electric components for micromachines. We have fabricated the monolithic devices and investigated the characteristics.