抄録
We propose a new method to develop three-dimensional micro systems by using hybrid assembling technique: IC or MEMS chips are patterned into connector structures on the fringes by anisotropic dry etching of silicon and orthogonally inserted into the slots in a micro base-chip to compose a miniaturized motherboard. Mechanical and electrical contact was completed by electroplating of copper. Small contact resistance (0.18Ω) and stray capacitance (50pF) were obtained. This technique relaxes the restriction due to the incompatibility between fabrication process of MEMS and that of integrated circuits, because those chips on the motherboard can be developed independently.
