Precise Micro-Nanomachining of Silicon

Abstract

Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF₂ silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.