電気学会論文誌E(センサ・マイクロマシン部門誌)
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
ディープX線リソグラフィーを基本とする3次元微細加工を用いたマイクロコネクタの開発
羽賀 剛奥山 浩平田 嘉裕高田 博史
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2000 年 120 巻 7 号 p. 363-369

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We have developed a microconnector with an automatic connecting/disconnecting mechanism employing magnetic force. The diameter and thickness of the microconnector is 2.5-mm and 2-mm, respectively. To obtain a large area and reliable connection, the terminals and guides must be perpendicular to the substrate of the microconnector and have high aspect ratios. These structures are fabricated using the LIGA-like process. The cantilever shape terminals as moving structures (7-μm-width, 80-μm-height and 300-μm-length) were fabricated using the one-layer sacrificial process. The tapered terminals and guides for the smooth connection were fabricated by micro-electro-discharge-machining combined with the LIGA-like process. We confirmed the electrical cronnection at 160mA/line and the automatic connection (disconnection) at a distance of 600-μm between opposing microconnectors.

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