抄録
Thermal diffusivity of Vacuum Process mold, dry sand mold, furan resin bonded sand mold and phenolic resin bonded sand mold, which contained less than 0.5 percent water, was obtained within 5 percent dispersion. That of the molds containing more water such as green sand mold, CO2 mold and plaster mold was also determined within 10 percent dispersion from temperature distribution in the dry zone. Chilling power of mold could be expressed by apparent thermal diffusivity taking moisture movement into consideration. The solidification time calculated by these obtained thermal properties coincided well with the measured value.
