Hot Deformation and Recrystallization of 3% Silicon Steel Part 1: Microstructure, Flow Stress and Recrystallization Characteristics

抄録

The recrystallization kinetics of 3% Si steel after hot rolling and plane strain compression at strain rates from 0.05 to 5s^-1 over a temperature range of 800 to 1100°C have been investigated. The flow stress of the ferritic 3% Si steel Indicates that the dynamic recovery rate is about two orders of magnitude faster than in austenite. Recrystallization rate after hot rolling is affected by deformation variables and is strongly influenced by the initial grain size. In coarse grained material, retardation of recrystallization resulted in the appearance of a plateau in the recrystallization curves. Austenite present during deformation affects both the strength during deformation and the subsequent recrystallization kinetics.