日本画像学会誌
Online ISSN : 1880-4675
Print ISSN : 1344-4425
ISSN-L : 1344-4425
Imaging Today
『マイクロパターニング・マイクロ加工技術の最前線』
Advances in Ultrafast Laser Microprocessing
Ming LiXinbing Liu
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2003 年 42 巻 3 号 p. 251-260

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We review recent advances in ultrafast laser technology as applied to the field of ultra-fine materials processing. Ultrafast lasers are a class of lasers that produce pulse widths of from picoseconds to femtoseconds. The most important characteristics of ultrafast laser-matter interaction include precise ablation threshold and absence of heat diffusion into the material during laser irradiation, both of which are due to the short temporal duration of the laser pulse. As the laser pulse width decreases from milliseconds through microseconds to nanoseconds and picoseconds, the material removal mechanism transitions from melt expulsion to direct ablative removal. This process is similar in many different solid materials, regardless of the material composition. In this paper, a number of ultrafast laser machining examples in a variety of materials are reviewed to illustrate this point. Precise ablation threshold, combined with narrow heat-affected zone, result in high quality materials processing
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© 2003 by The Imaging Society of Japan
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