Abstract
ZINK “Zero Ink” technology, it is possible to do single-pass direct thermal printing in full color. We examined simulation of full color thermal printing. We reported thermal head design by automatic iterative calculation of two-dimensional heat conduction analysis. This time, by enhancing an analytical model to three dimensions, we became possible the simulation of the temperature distribution not only in direction of Zink paper transportation and depth but also in in-plane each layer. As a result, the relation between the structure of thermal head and the internal temperature distribution of Zink paper was clarified. We examined the thermal head structure that is appropriate for full color thermal print by using this analytical model.
