PROCEEDINGS OF THE ITE ANNUAL CONVENTION
Online ISSN : 2424-2292
Print ISSN : 1343-1846
ISSN-L : 1343-1846
2004
Session ID : 20-7
Conference information

20-7 Photosensitivity spectrum of trans-chip eye-safe image sensor fabricated by bottom-side wafer bonding
Daisuke MoriTakashi TokudaKeiichiro KagawaJun OhtaMasahiro Nuoshita
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

We have been developing an image sensor which is capable to detect IR in eye-safe region. In this work, we demonstrate that eye-safe light can be efficiently detected with a sensor structure that consists of metal-bonded Si image sensor chip and Ge subwafer.

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© 2004 The Institute of Image Information and Television Engineers
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