抄録
In this paper, we suggest the FED packaging technology using anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonded. Glass-glass bonding is based on conventional silicon-glass bonding mechanism and achieved successfully. The FED panel having opened exhausting hole was formed by glass frit process and sealed by capping glass. From the leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED, then anode current was 34μA. Emission stability was constantly measured for 11 hours.
