抄録
Aiming at obtaining a thinner electrode layer, Ni powder of 0.2μm grain size was used and BaTiO3 particles of either 30 nm or 50 nm in size were added. The results indicate that when BaTiO3 nanoparticles with good dispersibility are added to Ni powder of 0.2μm, it is possible to suppress sintering of the Ni electrode paste film by adding BaTiO3 particles of 30 nm size, compared to the film using paste without any addition or with 50 nm BaTiO3 particles. This was clarified from the results of the firing shrinkage rate and the fine structure of the sintered surface.
