鋳造工学
Online ISSN : 2185-5374
Print ISSN : 1342-0429
ISSN-L : 1342-0429
研究論文
SiCp/Al-Si-Cu合金複合材料の電子ビーム再溶融におけるAl4C3の生成
佐々木 正登, 神長 美代志, 田上 道弘
著者情報
ジャーナル フリー

1999 年 71 巻 7 号 p. 455-459

詳細
抄録
  The contact of SiC particles with molten Al-Si-Cu alloy may result in Al4C3 formation in the electron beam remelting of aluminum alloy matrix composites, depending upon the matrix composition. It is known that the formation of Al4C3 is affected by melt temperature, holding time and silicon content in the matrices, and also high silicon levels are required to prevent the Al4C3 formation. However, the influence of copper content on the Al4C3 formation has not been clear. Therefore, the influence of silicon and copper content on the Al4C3 formation was studied, and the following results were obtained: high copper and low silicon content promote the Al4C3 formation in electron beam remelting. The formed plate-like Al4C3 prevents the bead surface from smoothing.
著者関連情報
© 1999 公益社団法人 日本鋳造工学会
前の記事 次の記事
feedback
Top