Journal of SHM
Online ISSN : 1884-1198
Print ISSN : 0919-4398
ISSN-L : 0919-4398
Multilayer Chip Impedor
Gen Daigaku, Hiroyuki Wada, Kazuhito Sakamoto
Author information
JOURNAL FREE ACCESS

1998 Volume 14 Issue 1 Pages 22-28

Details
Download PDF (3464K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

HYBRIDS

Circuit Technology

Successor

Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Share this page
feedback
 Top