Abstract
Two modelling methods have been proposed and studied for analysing mechanism of ion migration at electrodes on printed wiring boards. First modelling method has targetted analysing basic reaction and visualization of ion migration phenomena. Second modelling method has targetted measurement of copper dissolving ratio according to resistivity change of thin film electrode. Both modelling methods have contented the targets as expected and have given some analytical results as follows : circumstance of electrodes changing to promote reaction of ion migration, chelating agent relating ion transfer, ion dissolving to resin in accordance with solubility principle, higher insulation resistance leading to less ion migration, and so on.
