Fluxless Flip Chip Solder Joining for High Density Interconnect

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571

Fluxless Flip Chip Solder Joining for High Density Interconnect

G.J. DISHON, S.M. BOBBIO, M.A. PENNINGTON, R.F. LIPSCOMB, N. KOOPMAN, S. NANGALIA

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JOURNAL FREE ACCESS

1995 Volume 10 Issue 6 Pages 390-393

DOI https://doi.org/10.5104/jiep1995.10.390

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[in Japanese]

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© The Japan Institute of Electronics Packaging

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Circuit Technology

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