The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571
Thermal Fatigue Strength Evaluation of BGA Package Solder Joints
Yoshinori EBIHARA
Author information
JOURNAL FREE ACCESS

1995 Volume 10 Issue 6 Pages 394-400

Details
Download PDF (7314K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

HYBRIDS

Circuit Technology

Journal of SHM

Successor

Journal of The Japan Institute of Electronics Packaging

Share this page
feedback
 Top