Abstract
New Micro Connection Technology called“Nodular Connection”was developed for fine pitch FPC terminals or for TAB outer leads. Noduler Connection consists of the following processes. Dendrites (nodules) were formed vertically on the outer leads or the terminals by the electro-deposition in a special copper plating bath. An adhesive, liquid or sheet, was placed between TAB (or FPC) with dendrites on outer leads (terminals) and ITO transparent electrodes (or PCB terminals) . After position adjustment, compressive force was applied to close the gap between both circuits so that electric contact was obtained through the dendrites. The suitable dendrites formation was obtained under a plating bath composition; Cu: 8g/l, H2SO4: 100g/l, α or βNaphtoquinoline: 50 mg/l, and special electrolytic condition. Using these dendrites, Nodular Connections were carried out and their reliability and characteristics were determined by the environmental tests. The contact resistance of Nodular Connection was 1/10 to 1/100 of those of the common ACFs (Anisotropic Conductive Films) .
