Abstract
Photosensitive polyimide containing benzophenontetracarboxylic dianhydride (BTDA), maleic anhydride (MA), spiroacetal diamine (ATU) was synthesized. The curing reaction occurred at 230°C or below. The sensitivity and γ-value were 570mJ/cm2 and 2.5, respectively. The resolution performance on the film thickness of 13 m was 50μm L&S using negative photo mask and contact print on the material. We applied the photosensitive polyimide to coverlay vanish for flexible printed circuits (FPC) . Its laminates meets resistance to soldering heat test at 360°C and showed good flexibility at room temperature and maintained initial property immediately after moisture resistance test for 100hrs, where the test temperature was 60°C and the humidity was 95%RH, and after heat resistance test for 100hrs at 150°C. Its laminates had high acid and alkaline resistance and chemical resistance.
