Abstract
A PZT ceramics has been used in electronic devices such as pressure sencer, resonaters and capacitors because the ceramics possess piezoelectricity. Conductive paste is generally applied in the formation of circuits or electrodes on the ceramics. However, it is difficult to apply the conductive paste on micro circuits or electrodes required in the small sized electronic devices. Applicability of electroless copper plating on the ceramics was evaluated. Etching with mineral acid is usually adopted to obtain good adhesion between the ceramics and deposited copper. However, inherent electric properties of ceramics deteriorate due to the etching. For that reason, electroless copper plating on the ceramics without etching becomes important. Copper deposited on the ceramics without blister or lack of adhesion was obtained by the selection of an optimum pretreatment process and an optimum plating bath composition and conditions.
