A new conducting method for an epoxy resin laminate was proposed in this paper. The sulfo group, as a cation exchange group, was introduced onto the epoxy resin laminate surface through sulfuric acid treatment. The amount of adsorbed copper ions increased with increasing sulfuric asid concentration, and was 135n mol/cm² for the sample treated with 14M sulfuric acid solution at 60°C for three minutes. The thickness of the copper thin film formed after the reduction process was estimated to be 10nm. The conductivity of the sample was 0.030 S/_??_ (33Ω/_??_) . This process should be expected for new direct metallization technology.

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A PZT ceramics has been used in electronic devices such as pressure sencer, resonaters and capacitors because the ceramics possess piezoelectricity. Conductive paste is generally applied in the formation of circuits or electrodes on the ceramics. However, it is difficult to apply the conductive paste on micro circuits or electrodes required in the small sized electronic devices. Applicability of electroless copper plating on the ceramics was evaluated. Etching with mineral acid is usually adopted to obtain good adhesion between the ceramics and deposited copper. However, inherent electric properties of ceramics deteriorate due to the etching. For that reason, electroless copper plating on the ceramics without etching becomes important. Copper deposited on the ceramics without blister or lack of adhesion was obtained by the selection of an optimum pretreatment process and an optimum plating bath composition and conditions.

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[in Japanese]

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