Abstract
The growth kinetics of intermetallic compounds formed on the boundary between Au and In-48Sn solder was researched with diffusion couples. On heating under the melting point of In-48Sn solder, the AuIn2 layer was firstly formed on the boundary and grew toward the solder layer. Simultaneously, the γ layer was formed on the boundary between AuIn2 layer and solder layer. On the other hand, the AnIn2 layer, which was firstly formed, finally changed to the intermetallic compounds of Au-Sn system in heating over the melting point of that solder. That reaction was possible to be explained by the diffusion path described in the Au-In-Sn phase diagram. As the result of the Arrhenius plot for the growth rate constant, the activation energy of the growth of AuIn2 was estimated at 42.8kJ/mol.
