The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571
Photoimagable Dielectric Material for Build-up Printed Wiring Board
Toru TAKAHASHI
Author information
JOURNAL FREE ACCESS

1998 Volume 13 Issue 2 Pages 85-89

Details
Article 1st page
Content from these authors
© The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top