The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571
Release of Solder on Printed Circuit Boards by Heating and Vibrating
Katsuhito NAKAZAWAHironobu SAKATAHiroyasu SAKAMURAItaru YASUI
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JOURNAL FREE ACCESS

1998 Volume 13 Issue 2 Pages 90-96

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Abstract
Electric appliances utilize various toxic metal elements in their parts. For instance, solder containing lead (Pb) adheres to printed circuit boards, and antimony (Sb) remains in various electronic parts. After electric appliances have been used, they have been almost thrown away as waste in the dumping ground with no management for the recovering or for the recycling. Elution of a large extent of Pb may be caused by waste electric appliances under acidic rain for a long period. The waste management of electric appliances has been studied at various situations, but the practical system for the waste management has not been built up et. In this study, the removal of solder adhering to printed circuit boards was investigated by means of vibrating them under appropriate temperature, and solder more than 60% was removed from them. The elution of Pb in printed circuit boards before and after the removal of solder from them was also investigated under condition of nitric acid solution of pH3. The elution concentration of Pb from printed circuit boards was smaller after than before the treatment above mentioned. As for the pre-treatment of waste electric appliances, it is desirable to establish the recovering or the recycling management system of them.
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© The Japan Institute of Electronics Packaging
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