2019 Volume 12 Pages E19-012-1-E19-012-8
Joining of dissimilar materials is extremely important for flexible electronic packaging, which is generally achieved by assembly of pre-patterned electronic components into multi-layered architectures on soft organic substrates via transfer-printing technique. To avoid thermo-mechanical damages during bonding, organic- and inorganic-organic solid-state direct bonding must be achieved. Here we report a novel bonding process enabling both homogeneous and heterogeneous material hybridization at low temperatures. Vacuum-ultraviolet-induced reorganization of ethanol was used to achieve multiple effects of surface modification on organic and inorganic surfaces before bonding, which has been named ethanol-assisted vacuum ultraviolet irradiation (E-VUV) process. In this study, investigation of X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) was conducted to thoroughly understand adhesion mechanism. The analytical results proved that the E-VUV process was applicable to polyetheretherketone- and tin-polyimide bonding, and the bonded interfaces are expected to be robust enough for flexible electronic packaging.
