Benzoxazine-modified BMI Heat-resistant Resin with Low Dielectric Properties

抄録

Benzoxazine modified BMI resin is a low dielectric curing resin obtained by synthesizing three types of benzoxazines with C36 diamine (C36DA) biomass material and reacting them with BMI having a biomass material backbone. In particular, the 2-allyl phenol/C36 diamine type benzoxazine modified C36 bismaleimid (B36-APda) resin curing compound (equivalent ratio 1:0.3) has a high 3% and 5% weight loss temperature (Td3 = 372°C/Td5 = 393°C), excellent strength (Max.stress = 1.71 kgf/mm²)and toughness (Toughness = 42.6 kgf-mm/mm³) properties, and low dielectric loss tangent, which implies the presence of the so-called ene reaction between the combined allyl and maleimide. The addition of the paraxylylene bisdiphenylphosphine oxide (PBO) phosphorus flame retardant to this resin after curing produces a flame retardancy and can further the improve heat resistance and reduce the dielectric loss tangent to 0.0015~0.0019 at 10 GHz.