2021 年 14 巻 p. E21-001-1-E21-001-13
Highly heat-resistant molding materials are required for manufacturing power modules. We investigated a sheet molding material where a blend of rigid and flexible maleimide resins (MA and MB, respectively) offer high heat resistance and toughness enhancement for wide-bandgap semiconductor packaging applications. We found that the MB formulation with 30% by weight of the maleimide resin enhanced toughness of the maleimide resin blend. This formulation passed -55/200°C package-level temperature cycle tests without compromising the heat resistance. We also found that the maleimide resin blend exhibited a strong adhesion strength to Cu foil (7.3 N·cm-1). This performance maintained even after thermal storage at 200°C for 1,000 h. We think that the developed sheet molding material can be used for high-temperature-operating power modules manufactured with fan-out panel-level packaging.
