Failure Analysis and Stress Evaluation of Maleimide Molding Films during Temperature Cycling

抄録

It is of paramount importance to develop semiconductor packaging materials with both high heat resistance and toughness. Thus, we designed and studied various maleimide molding sheets and investigated the relationship between the amount of flexible maleimide resin and defect development, including delamination and resin cracks, during temperature cycling (TC). The stress singularity parameters computed from the interfacial stress field during the TC and die shear tests showed that delamination became more likely as the amount of flexible maleimide increased. The flexural stress criterion for crack prevention was computed using stress singularity theory. Crack formations were observed for the tested packages of the materials with measured flexural stress values below the stress values of the criterion for the TC test. Furthermore, a simple equation was proposed to determine the stress criterion from material properties.