Development of Copper Materials and Processing for Printed Electronics

抄録

New material technologies for screen printing electronics were studied. A novel conductive paste which can be metallized at 180°C under reactive gas condition was developed using needle-shaped copper compound particles without any dispersant, protective agents or binder resins. The obtained conductive trace of dense 1.5 μm thick Cu layer with a crystal structure showed the volume resistivity of 2.4 μΩ·cm and excellent reliability. The metallization mechanism and excellent electrical performance were concluded to be different from those of the sintering.