Surface Morphology and Characteristics of Electroplated Au/Ni Films for Connector Contact Materials

Abstract

The surfaces of the connector terminals used for electrical connection of components are electroplated with Sn, Au, or Ag in order to improve reliability. For electronic devices that require particularly high reliability, hard gold is used. The characteristics of gold deposits of various surface morphologies were examined. Gold films with increased surface roughness exhibited superior friction and wear properties without a large increase in contact electrical resistance after friction testing. Increasing the surface roughness also resulted in higher solder adhesion strength and improved corrosion resistance to sulfur dioxide gas.