Bonding Pad Fabrication for Printed Electronics Using Silver Nanoparticles

Makoto Nakatani; Haruyuki Nakajo; Hiroshi Saito; Masayuki Ueda; Hideyuki Gotoh

doi:10.5104/jiepeng.6.99

Technical Papers

Bonding Pad Fabrication for Printed Electronics Using Silver Nanoparticles

Makoto Nakatani, Haruyuki Nakajo, Hiroshi Saito, Masayuki Ueda, Hideyuki Gotoh

Author information

Keywords: Printed Electronics, Nanoparticle, Silver Nanoparticle Paste, Silver Hybrid Paste, Ink-jet Printing, Screen Printing, Wire Bonding

JOURNAL FREE ACCESS

2013 Volume 6 Issue 1 Pages 99-103

DOI https://doi.org/10.5104/jiepeng.6.99

Details

Abstract

Silver nanoparticle paste (SNP) was demonstrated to be a promising candidate as an alternative material to conventional silver electro-plating. The sintered film of SNP in a reductive atmosphere showed excellent bonding strength equivalent to the value of the silver electro-plated surface in gold and copper wire bonding. The silver hybrid paste (SHP) composed of micro and nanoparticles has been newly developed. SHP with 40 μm thickness exhibited low volume resistivity after sintering. The sintered film showed good wire bondability.

Corresponding author

Register with J-STAGE for free!