Transactions of The Japan Institute of Electronics Packaging
Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365
Technical Papers
Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability of the Solder Joint
Hanae ShimokawaTasao SogaKoji SerizawaKaoru KatayamaIkuo Shohji
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2015 Volume 8 Issue 1 Pages 46-54

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Abstract

This paper presents low-temperature Pb-free soldering technology using Sn-57Bi-1Ag (mass%). Here, the effects of high-temperature annealing on the mechanical properties of the solder such as tensile strength and elongation are investigated. The experimental results show that during annealing, the sizes of both of Sn and Bi phases coarsen, however the mechanical properties do not deteriorate. The deformation behavior of Sn-57Bi-1Ag is found to be dependent on sliding at grain boundaries between Sn and Bi phases, and this behavior remains consistent even after coarsening. The creep strength of solder joint at high temperature is also studied, and it is found that Sn-57Bi-1Ag exhibits superior creep strength at temperature below approximately 100°C compared to the Sn-37Pb (mass%) solder.
The thermal cycling test of Sn-57Bi-1Ag solder joint is also conducted under the condition between 0°C and 90°C. The result shows that the length of crack is shorter than Sn-37Pb in the same conditions, which means Sn-57Bi-1Ag is an effective material for low temperature soldering.

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© 2015 The Japan Institute of Electronics Packaging
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