日本金属学会誌
Online ISSN : 1880-6880
Print ISSN : 0021-4876
ISSN-L : 0021-4876
Mg2Si1−xGex固溶半導体の作成とその熱電特性
野田 泰稔大塚 信之増本 剛西田 勲夫
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1989 年 53 巻 5 号 p. 487-493

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The Mg2Si1−xGex solid-solution semiconductors were prepared in the composition range 0≤x≤0.45. The Ham effect, thermoelectric power and electrical conductivity were measured and the maximum figure-of-merit (Z) was estimated for the undoped sample at the composition x=0.45. The carrier concentrations at 300 K were controlled at this compositon to 1.4×1025 m−3 electrons and 1.8×1025 m−3 holes by doping the nominal amount of 1600 ppm Sb and 20000 ppm Ag at this composition, resulting in the figure-of-merits of 6.8×10−4 K−1 and 3.8×10−4 K−1, respectively. The measurement of thermoelectric power showed that these doped samples behaved as extrinsic semiconductors up to 850 K. The maximum figure-of-merits at 700 K were estimated to be 1.5×10−4 K−1 for the n-type sample and 3.4×10−4 K−1 for the p-type one. From the fact that the value of the n-type sample was larger than those of the traditional materials, the Mg2Si1−xGex solid-solution semiconductors can be expected as a new candidate material for thermoelectric energy conversion in the middle-temperature range.
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