精密工学会誌
Online ISSN : 1882-675X
Print ISSN : 0912-0289
ISSN-L : 0912-0289
論文
すきま理論に基づくラッピングシミュレーション(第1報)
—試料・工具の接触状態と相対弾性定数—
宇根 篤暢後藤 賢次吉冨 健一郎餅田 正秋
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2010 年 76 巻 3 号 p. 299-303

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Lapping technique has been usually applied to achieve high flatness to large plates that are used to manufacture liquid crystal displays of televisions and computers. The lapping simulation to calculate the surface generation process for various tool and workpiece profiles barely has been studied. On the other hand, the polishing simulation based on the gap theory was developed and it was clarified that the simulated results agreed well with experimental results. This paper describes the concept to apply the polishing simulation to lapping and the hypothesis to treat a rigid tool as an elastic body. The experimental results during a transitional period when lapping area expands from the local part to the whole surface were compared with the simulated results calculated using the gap theory. It was demonstrated that the relative elastic coefficient decreases with lapping time and converges to a constant value. The convergent value becomes large with the slope of the tool, but the grain size has no effect. The correlation exists between the relative elastic coefficient and the contact ratio of the workpiece with the tool. However, the relative elastic coefficient cannot be unambiguously determined by the contact ratio, and the slope of the tool or the gap gradient should be introduced to the simulation parameter.

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