抄録
A chucking becomes important in the thinning process for electrical device stacking technique and the deposited film planarization for device-multi-layer wiring technique. We developed a pin-type vacuum chuck for high precision machining. It takes refuge from the dust influence to achieve flattening. But it must be considered that the dimpling is caused by wafer deformation due to pin sustainment when a thin wafer is used. In this paper the influence of pin sustainment was analyzed with inhomogeneous process pressure by the fluctuation of surface profile or roughness. In consequence the surface profile fluctuation made the inhomogeneous process load. It was revealed that this affected the dimpling amount.
