水晶ポリシ層における二次われ
水晶板ポリシングの研究(第4報)
1959 年 25 巻 299 号 p. 532-538
詳細
1959 年 25 巻 299 号 p. 532-538
The cause and the depths of secondary flaws are studied by scratching and polishing technique. The residual stress is calculated under the simplified conditions, and the model section of polished surface is given.
The results obtained are as follows :
(1) The fracture by tension causes the secondary flaws.
(2) The depths of flaws before etching are of the order 20010, 000A°
(3) The residual skin stress is more 40 times larger than the average stress.
(4) The depth of the polished layer is of the order 40A°. Secondary flaws have an effect on the deformation at depths of 40700A°, and deepest scratches show their previous traces down to 30, 000Å.
