ラッピングにおける砥粒分担荷重の評価

Si単結晶のラッピング機構に関する研究 (第1報)

抄録

By using a model lapping technique, the acting force is evaluated based on the relation that the dislocation extent produced by indentation on Si (111) surface increases with the load. The distribution of the acting force is also obtained and interactions between abrasive grains and the Si surface are discussed with the aid of the electronmicroscopic observation on the surface worked. The main results obtained are as follows : (1) The number of grains which acting takes part in lapping is only about 0.34% of total grains existing on the working area of the lap in the range of lapping pressure 23409 g/cm². (2) The acting force is independent of lapping pressure and its magnitude is about 6.9 g by the use of WA # 800. (3) The number of grains which do scribing is about 10% or less of acting grains. (4) The distribution curve of the acting force is very similar to that of grain minor axes.