1980 年 46 巻 5 号 p. 584-590
In this paper, several measures are discussed experimentally in order to withstand the influence of cutting fluid, chips, temperature change and materials which will surely cause the reduction of measuring accuracy in in-process measurement. Itis pointed out through various experiments that these effects could be reduced by the use of air jet methods, temperature compensation in a bridge circuit, output regulated laser unit and diffusion light from a laser spot. Consequently, an optical measuring method was found to be more promising than other methods, when the measures against various disturbances were taken adequately.