抄録
This paper proposes a method for making wire tools. It has been known that wire tools are used for lapping, EDM, etc. But their removal rate is very low. Then a wire tool is developed to which 10μm diamond grains are adhered by nickel plating. φ0.2mm nude wire, copper wire or piano wire, is wound from the first drum to the second one at a given speed. On the way it is plated nickel in the grains pool and diamond grains are taken in the niekel layer. By this method the number of adhered-grains can be increased. The followings are obtained. The higher the current density is, the more the number of adhered-grains are. But when it is too high, either the wire tools surface becomes rough or cracks occur on the nickel layer. The higher wirevelocity is, the less the number of adhered-grains are. When it is too high, diamond grains aren't taken in the nickel layer. On 2.27-4.55A/dm2 and 7.24-18.1mm/min, the expected wire tools can be obtained.
