This paper presents a description of a system developed by the authors for measuring the flatness of the blade of a silicone slicer and its practical use in design of a slicing machine. This system enables us to scan the blade surface without bringing the sensor into contact with it and represent the resultant data on the display, either as a contour map in colors or a bird's-eyeview picture. Relying on these forms of feedback from the system, we have succeeded in designing an improved blade-chuck which guarantees a high degree of flatness for slicer blades. This design has made it possible to significantly cut down on the breakages of wafers occurring in the production process and raise the slicing velocity, thus bringing greater efficiency to the production of wafers.
