微小切込み装置の開発

抄録

This paper describes a micro cutting system to cut a uniform and submicrometer deep groove over a whole desk. A micro cutting device consisting of a pair of parallel springs and a piezo-electric actuator has been developed. The device is designed using the finite element method and has a good dynamic response up to 2kHz with a stiffness of 80 N/μm and an infeed resolution of 5nm. A micro cutting system with the device is proposed which can detect the initial contact between the tool and the cutting surface with an accuracy of ±0.1μm. Submicrometer cutting where the depth of cut is set with reference to the initial contact position, was accomplished.