ファインセラミックスの研削仕上面状態に及ぼす加工条件の影響(第1報)

SiC,Si₃N₄およびAl₂O₃の仕上面の生成機構

抄録

In precision grinding of normal sintered fine ceramics of silicon carbide, silicon nitride and alumina, the effects of grinding conditions on the ground surface aspects and the removal mechanism of these materials are investigated experimentally. As the results, the following facts are clarified. (1) When the cutting area of an abrasive grain or wheel speed is reduced, the proportion of brittle fracture area on the ground surface decreases and so surface roughness becomes small. (2) The surface roughness depends strongly on the trace of brittle fracture. (3) As the cutting area of an abrasive grain becomes small, the removal mechanism of materials changes to plastic deformation type from brittle fracture type. (4) The lower wheel speed is, the larger the critical cutting area which material removal of an abrasive grain is caused by plastic deformation becomes. The value of silicon carbide is larger than the value of silicon nitride.