磁性流体を利用したGLP (Grinding-like Polishing) の研究 (FFF)

シリコンウエハの平面研磨特性

抄録

A new type of field-assisted fine polishing method for brittle materials has been proposed, which is developed for applying to the polishing on NC grinding machine without the vessel for polishing compound. In this method, the non-contact type polishing is realized with fluid grinding wheel which is covered with thick magnetic fluid film holding the abrasive grain. In this report, the surface polishing experiments are conducted on silicon wafers and the polishing characteristics are examined. The following results are obtained : (1) When the clearance between the polisher and the work surface exceeds the definite value, the polishing rate decreases extremely. (2) The use of water based magnetic fluid yields lower polishing rate but smoother surface in comparison with kerosene based magnetic fluid. (3) The surface roughness of polished surface basically depends on grain size and the roughness of the order of nanometers is obtained with fine abrasive grain.