砥粒加工による超薄型水晶加工技術

抄録

This paper presents an investigation into processing technology of ultra-thin quartz with abrasives. Quartz plate is processed industrially with double-sided lapping equipment. The thinner thickness of quartz, the larger obtained frequency. However, it is impossible to make quartz plate with a thickness of less than 30μm due to the distinct limit in the thickness of the carrier. In this experiment, single-sided lapping equipment was used for lapping and polishing to create ultra-thin quartz. It was noted that protection of the quartz edge and the flatness of the lapping plate and polishing pad are important. Therefore, an iron washer was used to protect the quartz edge and the lapping plate and polishing pad were made flat by facing. During the experiment, this flatness was maintained by placing a conditioning ring with a weight of 3kgf on the lapping plate. By maintaining the flatness of the lapping plate, a high reproduction was achieved. During polishing, the rotating speed was varied and a nonwoven fabric was used with a slurry containing Si0₂ with 0.5μm in diameter and CeO₂ with 0.7μm in diameter. As a result, a quartz sample with a thickness of around 10μm was produced.