高精細液晶ディスプレイ実装システムの開発(第2報)

液晶駆動ICボンディングツールの熟解析

抄録

For higher definition and lower cost liquid crystal display, improvement of the mounting accuracy and productivity of liquid crystal driver IC in TCP (Tape Carrier Package) is essential.
In order to mount several TCP's, which previously have been mounted one by one, at one time, temperature-homogenous long bonding tool is needed. The FEM (Finite Element Method) has been used until now for the thermal analysis of the long bonding tool. However, there was a big difference between an analytical and measured values. In order to solve this problem, an FVM (Finite Volume Method) is used, in which ambient air flow and thermal effects on adjacent parts are taken into consideration for heat and flow analysis, for leading to temperature-homogenous of bonding tool.