抄録
The recent research of Powder Injection Molding (PIM) is begining to be shifted to reducing the debinding time and keeping the shape during debinding. Though there are some methods of removing the binders, the solvent debinding which can solve the problems mentioned above becomes to get much attenion.
Here discussed the injection molding of silicon nitride powder by using both the thermal and the solvent debinding process. All the components of the binder dissolved into the solvent. This is different from the conventional AMAX process. The main results were summarized follow: l)The debinding time by using thermal and solvent debinding process could be remarkably reduced. 2)The practicabilities of removing binders and keeping the shape of green body during solvent debinding were affected by extraction conditions.
